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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/20 tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 datashee t 4.5v to 18v, 3a 1ch synchronous buck converter BD95835EFJ description BD95835EFJ is a 1ch synchronous buck converter that can generate a wide range of output voltage at the input voltage range (4.5v to 18v). space-saving and high efficient switching regulator can be achieved due to built-in n-mosfet power transistors. the ic also incorporates constant on time control mode which facilitates ultra-high transi ent response against changes in load. variable soft start function, short circuit protection and over voltage protection are incorporated. the BD95835EFJ is designed for power supplies for digital av equipment. applications ? lcd tvs ? set top boxes (stb) ? dvd/blu-ray players/recorders ? broadband network and communication interface ? amusement, other. typical application features ? input voltage range: 4.5v to 18.0v ? output current: 3.0a (max.) ? reference voltage: 0.750v 1.2% ? output voltage range : 0.9v to vin x 0.7 using switching frequency 200khz freq 600khz ? output voltage range : 0.9v to vin x 0.6 using switching frequency 600khz freq 800khz ? built-in power mos fet high-side nch fet on resistance: 100m (typ.) low-side nch fet on resistance: 100m (typ.) ? fast transient responses due to on time control ? over current protection (ocp) ? thermal shut down (tsd) ? under-voltage lock-out (uvlo) ? short circuit protection (scp) ? over voltage protection (ovp) ? variable soft start package w(typ.) x d(typ.) x h(max.) htsop-j8 4.90mm x 6.00mm x 1.00mm pin configuration (top view) figure 1. t ypical application circuit l b b i h o ho o i figure 2. pin configuration ss en fb b s t vin sw gnd rt 7 8 6 5 3 4 2 1 (top view) downloaded from: http:///
datasheet datasheet 2/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 block diagram pin description no. symbol description 1 bst high side fet gate driver power supply pin. connect 0.1f capacitor and 82 resistor between bst and sw. boot voltage swings from vreg to (vin + vreg) during normal switching operation. 2 vin input voltage supply pin. connect over 10 ? f ceramic capacitors for decoupling to pgnd as near as these pins. 3 sw switch node connection between high side fet source and low side fet drain. connected to inductor (l). 4 gnd gnd pin for the ic. 5 fb output voltage feedback pin. fb is compared with ref in the ic. 6 rt connect a resistor to determine ontime. 7 en enable input pin. when the input voltage of the en pin reaches at least 1.2v, the switching regulator becomes active. at the voltage less than 0.2 v, the ic becomes standby mode. 8 ss connect a capacitor to determine soft start time. figure 3. block diagram - vref tsd uvlo i bias cmp softstar t vreg 5v vreg 3. s w 2. v i n 1. b st 8. ss vin s lvs ++ lo g i c r 6. rt 5. f b 7. e n tim e r scp ov p on t i m e ocp vin fb oc p l oc p h 4. g n d downloaded from: http:///
datasheet datasheet 3/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 ) parameter symbol limit unit input voltage vin 20 v sw voltage v sw 20 v sw voltage (10ns transient) v sw (ac) 22 v en voltage v en 20 v bst voltage v bst v sw +7 v ss, fb, rt voltage v oth 7 v power dissipation pd 3760 *1 mw ja *2 ja 29.27 /w jc *2 jc 3.75 /w operating temperature range topr -40 to +85 storage temperature range tstg -55 to +150 junction temperature tjmax 150 *1 derating in done 30.08 mw/ for operating above ta 25 (mount on 4-layer 70.0mm 70.0mm 1.6mm board) *2 moutn on 4-layer 50mm x 30mm x 1.6mm operating ratings (ta= -40 to 85 ) parameter symbol limit unit min typ max input voltage v in 4.5 12 18 v sw voltage v sw -0.5 - 18 v output current i sw3 - - 3 a output voltage range v range 1 0.9 - v in x 0.7 v output voltage range v range 2 0.9 - v in x 0.6 v please use at the frequency range : 200khz freq 600khz. please use at the frequency range : 600khz freq 800khz. frequency range is limited by input / output conditions. downloaded from: http:///
datasheet datasheet 4/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ? electrical characteristics (unless otherwise noted, vin=12v, ta=25 ) parameters symbol limit unit conditions min typ max [output voltage detection block] fb input bias current i fb - - 1 a fb = 1v fb threshold voltage v fb1 0.741 0.750 0.759 v ovp threshold voltage v fb1 0.85 1.00 1.15 v scp threshold voltage v fb2 0.40 0.500 0.60 v [output driver block] high side fet on resistance r onh - 100 - m ? i sw = -0.8a, bst = 16v low side fet on resistance r onl - 100 - m ? i sw = 0.8a high side fet leak current i leakh - 0 1 a v in = 18v v sw = 0v low side fet leak current i leakl - 0 1 a v sw = 18v high side fet ocp threshold i limit1 - 6 - a low side fet ocp threshold i limit2 - 4 - a internal ontime t on 360 440 520 ns rt = 51k , fb = 0.6v min offtime t moff - 380 - ns vin=12v [other blocks] en input bias current i en 30 50 70 a v en = 12v en threshold voltage v en 0.4 1.2 2.0 v en hysterisys voltage v enhys - 0.2 - v uvlo disable voltage v uvlo 3.8 4.0 4.2 v uvlo hysterisys voltage v hys - 0.2 - v ss charge current i ss 8 10 12 a ss reset voltage v ssl - 0.3 - v protection latch timer t latch - 27 - s ss discharge resistance r ss - 5 - k output discharge resistance r vout - 1 - k circuit current i cc - 1.0 2 ma v en = 12v stand by current i qui - 15 27 a v en = 0v downloaded from: http:///
datasheet datasheet 5/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise noted ta=25 , vin=12v, vout=3.3v, freq=400khz) 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 iout [a] efficiency [%] figure 4. efficiency 1 (vin=12v, l=4.7 ? h, 400khz) figure 5. efficiency 2 (vin=12v, vout=3.3v, l=4.7 ? h) figure 6. vout ripple voltage (vin=12v, vout=3.3v, l=4.7 ? h, cout=20 ? f, iout=0a) figure 7. vout ripple voltage (vin=12v, vout=3.3v, l=4.7 ? h, cout=20 ? f, iout=3a) vout (ac) 20mv/div sw 5v/div 2 ? sec/div vout (ac) 20mv/div sw 5v/div 2 ? sec/div vout = 5.0v vout = 3.3v vout = 1.2v 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 iout [a] efficiency [%] 400khz 600khz downloaded from: http:///
datasheet datasheet 6/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise noted ta=25 , vin=12v, vout=3.3v, freq=400khz) (continued) figure 8. vout vout load regulation (vin=12v, vout=3.3v, l=4.7 ? h) figure 9. vout vout line regulation (vout=3.3v, l=4.7 ? h, iout=0a / 3a) figure 10. vout - temperature (vin=12v, vout=3.3v, l=4.7 ? h, iout=0a) figure 11. frequency - vin (vin=12v, vout=3.3v, l=4.7 ? h, iout=0a) 3.15 3.20 3.25 3.30 3.35 3.40 3.45 0123 iout [a] vout [v] 3.15 3.20 3.25 3.30 3.35 3.40 3.45 4 8 12 16 20 vin [v] vout [v] iout=0a iout=3a 300 350 400 450 500 550 600 4 8 12 16 20 vin [v] frequency [khz] 3.15 3.20 3.25 3.30 3.35 3.40 3.45 -40 -20 0 20 40 60 80 100 temperature [ ] vout [v] downloaded from: http:///
datasheet datasheet 7/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (unless otherwise noted ta=25 , vin=12v, vout=3.3v, freq=400khz) (continued) figure 12. start up wave form (vin=12v, vout=3.3v, l=4.7 ? h, cout=20 ? f, iout=0a) figure 13. off wave form (vin=12v, vout=3.3v, l=3.3 ? h, cout=20 ? f, iout=0a) figure 14. vout transient response (vin=12v, vout=3.3v, l=4.7 ? h, cout=20 ? f) iout=0 ? 2a figure 15. ocp function (vin=12v, vout=3.3v, l=4.7 ? h, cout=20 ? f) (vout is shorted to gnd) en 10v/div sw 10v/div vout 2v/div 2msec/div en 10v/div sw 10v/div vout 2v/div 10msec/div vout (ac) 100mv/div iout 2a/div 100 ? sec/div vout 2v/div sw 20v/div il 5a/div 5msec/div ss 5v/div downloaded from: http:///
datasheet datasheet 8/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected 1. constant ontime and operating frequency ontime (ton) can be determined by vin input voltage and rt resistor. ton = fb 154pf ( 1 / vin ) (rt + 5k ) + 10nsec freq = vout / vin 1 / ton ? fb : fb threshold voltage (0.765v, typ.). ? 154pf, 5k , 10nsec are constant values in the ic. ontime and frequency are calculated as below when vin=12v, vout=3.3v, rt=62k . ton = 0.750 [v] 154p [f] ( 1 / 12 [v] ) ( 62k [ ] + 5k [ ]) + 10n [sec] =655n [sec] freq = 3.3 [v] / 12 [v] 1 / 655n [sec] =420k [hz] ontime and frequency also depends on other c onditions such as output current load. 2. inductor (l) selection a larger current than the inductors rat ed current will cause magnetic saturation in the inductor, and decrease efficiency. when selecting an inductor, be sure to allow enough marg ins to assure that peak current does not exceed the inductors rated current value. to minimize loss of inductor and improve efficiency, choose a inductor with a low resistance (dcr, acr). the value of i l is shown as formula below. the larger value o f the inductance or the faster sw itching frequency make the lowe r ripple voltage. i l = (v in -v out ) v out l v in f [ a ] the proper output ripple current setting is about 30% of maximum output current. i l = 0.3 i out max. [a] l= (v in -v out ) v out i l v in f [ h ] ( i l : inductor ripple current, f:switching frequency i l vin i l l co v out figure 16. inductor ripple current hg sw lg downloaded from: http:///
datasheet datasheet 9/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3. output capacitor (c out ) selection also, give consideration to the conditions in formula below for output capacitance, bearing in mind that output rise time must be established within the fixed soft start time. as output capacitance, bypass capacitor will be also connected to output load side (c ext , figure 23). please set the over current detecti on value with regards to these capacitance. note: an improper output capacitor may cause startup malfunctions. 4. input capacitor (cin) selection a low esr capacitor is recommended to reduce esr loss and improve efficiency. output capacitor (c out ) has a considerable influence on output voltage regulation due to a rapid load change and smoothing output ripple voltage. determine the capacitor by considering the value o f capacity, the equivalent series resistance, and equivalent series inductance. also, make sure the capacitors voltage rating is high enough for the set output voltage (including ripple). output ripple voltage is determined as in formula below. v out = i l /(8 cout f)+esr i l +esl i l / t on (esr: equivalent series resistance esl: equivalent series inductance) co+c ext ts s (limit-i out ) v out limit: ocp current limit i out : output current tss: soft start time vin l c out v out esr figure 17. output capacitor esl hg sw lg load c ext figure 18. input capacitor in order to prevent transient spikes in vo ltage, the input capacitor should have a lo w enough esr resistance to fully support a large ripple current. the formula for ripple current i rms is given as below. i rms =i out v out ( v in -v out ) v in [ a ] where v in =2 v out, i rms = i out 2 v in l co v out c in hg sw lg downloaded from: http:///
datasheet datasheet 10/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 5. output voltage setting in the case of ceramic capacitors with sm all esr, the fb ripple is very small. so it needs external ripples to stabilize the sy stem. the fb voltage ramp is expected around 50mv. the external ramp is generated through the circuit as follows. sw rsw rup vout fb rdown csw vripple fb( dc) sw vout fb ref figure 19. ripple injection circuit the fb ramp follows: vripple = (vin C vout) ton / (csw rsw) t < csw rup//rdown << csw rsw so, average fb voltage follows: fb(dc) = 0.75v + vripple/2 periodically averaged, sw voltage is equal to vout. so output voltage vout follows: vout = fb(dc) {1 + rup//rsw / rdown}. in case of output capacitor with large esr, no ex ternal ramp circuit is needed. vout follows: vout = fb(dc) {1 + rup / rdown} downloaded from: http:///
datasheet datasheet 11/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 6. soft start time soft start delay td soft star time tss determines as follows: td = css vth / iss [sec] tss = css vref / iss [sec] css ss pin external capacitor vth internal mos vth typ 0.7v vref reference voltage typ. 0.75v iss ss charge current typ. 10ua rush current is determined as follows: iin = cout vout / tss [a] figure 20. soft start timing chart when en=l, uvlo, tsd operates, ss is discharged. in case of self-resume type, ss is also discharged after 30us latch off delay detecting ovp or scp. ss discharge resistance rss = 5k typ en ref vout i_vin td tss ss fb downloaded from: http:///
datasheet datasheet 12/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operation description 1. load transient operation vref fb iout when load changes, off time become short and frequency become high. this operation prevent the out p ut volta g e dro p . sw figure 22. load transient operation when fb bellows ref voltage, sw goes high for constant ontime. when load changes fast, short sw=l time cause high frequency and small vout drop. sw=l time is normally limited by min_offtime depending on vin voltage. external ramp circuit influenc e load response characteristics. 2. high-side fet ocp function when high-side fet current exceeds ocp limit, high-side fet is off. sw=l time is normally limited by min offtime, but is limited by 10 times min offtime after ocp det ected. this operation decrease coil current, 3. low-side fet ocp function when low-side fet current from sw to gnd exceeds ocp limit, low-side fet is off. 4. scp function figure 22. scp timing chart scp monitors fb voltage. when fb falls below 0.5v, 27 ? s later, sw=hiz and ss is discharged when ss<0.3v, the ic is reset and restart. 0.5 v 0.3v vo fb sw ss 0.3v short to gnd 27 ? s downloaded from: http:///
datasheet datasheet 13/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 5. ovp function figure 23. ovp timing chart scp monitors fb voltage. when fb exceeds 1.0v, 27 ? s later, sw=hiz and ss is discharged when ss<0.3v, the ic is reset and restart. 6. tsd operation (self recovery) if the junction temperature exceeds tj = 175 , sw=hiz and ss is discharged. when tj falls below 160 , it returns to standard operation . 7. uvlo operation when vcc falls below 3.8v, uvlo operates. sw=hiz and ss is discharged. uvlo is released when vcc goes up to 4.0v, and starts normal operation. 1.0 v vo fb sw ss short to vin 27 ? s downloaded from: http:///
datasheet datasheet 14/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pcb layout guide two high pulsing current flowing loops exist in the buck regulator system. the first loop, when fet is on, starts from the input capacitors , to the vin terminal, to the sw terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the low fet, to the inductor, to the output capacitor, and then returns to the low fet through gnd. to reduce the noise and improve the efficiency, please minimize these two loop area. especially input capacitor and output capacito r should be connected to gnd (pgnd) plain. pcb layout may affect the thermal performance, noise and efficiency greatly. so please take extra care when designing pcb layout patterns. ? the thermal pad on the back side of ic ha s the great thermal conduction to the ch ip. so using the gnd plain as broad and wide as possible can help thermal dissipation. and a lot of the rmal via for helping the spread of heat to the different layer i s also effective. ? the input capacitors should be connected to pg nd as close as possible to the vin terminal. ? the inductor and the output capacitors should be placed close to sw pin as much as possible. c in fet c out l vout vin figure 24. current loop buck regulator system downloaded from: http:///
datasheet datasheet 15/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 evaluation board circuit ? recommended components list (vin=12v, vout=3.3v, freq=420khz) the above components list is an example. please check actual circuit characteristics on the application carefully before use. symbol part value manufacture series l coil 4.7 ? h toko fdvc0630-4r7m tdk spm6530-4r7m c_vin ceramic capacitor 10 ? f / 25v murata grm31cr71e16ka12 c_vo1 ceramic capacitor 10 ? f / 25v murata grm31cr71e16ka12 c_vo2 ceramic capacitor 10 ? f / 25v murata grm31cr71e16ka12 c_bs ceramic capacitor 0.1 ? f / 50v murata grm18 series r_bs resistance 82 rohm mcr03 series c_ss ceramic capacitor 0.1 ? f / 50v murata grm18 series r_rt resistance 62k rohm grm18 series r_up resistance 36k rohm grm18 series r_dw resistance 10k rohm mcr03 series r_sw resistance 360k rohm mcr03 series c_up ceramic capacitor 390pf / 50v rohm grm18 series figure 25. typical application circuit c_vo2 r_ rt r_up c_bs c_vin r_dw c_ss l ss en rt fb bst vin gnd sw thermal pad (to be shorted to gnd) vin 12v v out 3.3v r_bs r_sw c_up c_vo1 downloaded from: http:///
datasheet datasheet 16/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuit . b . b . i . . . . . i i downloaded from: http:///
datasheet datasheet 17/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open m ode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. (2) gnd voltage the potential of the gnd, pgnd pin must be the minimum potential in the sy stem in all operating conditions. (3) thermal design use a thermal design that allows for a sufficient margin fo r power dissipation (pd) under actual operating conditions (4) inter-pin shorts and mounting errors use caution when orienting a nd positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply and gnd pins caused by poor soldering or foreign objects may result in damage to the ic. (5) operation in strong electromagnetic fields using this product in strong electromagnetic fields ma y cause ic malfunction. caution should be exercised in applications where strong electromagnetic fields may be present. (6) aso (area of safe operation) when using the ic, ensure that operati ng conditions do not exceed absolute maximum ratings or aso of the output transistors. (7) testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from a jig or fixture during the eval uation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. (8) electrical characteristics the electrical characteristics indicated in this datasheet ma y change upon the conditions of temperature, supply voltage, and external components. please validate/verify your design at the worst case conditions. (9) not of a radiation-resistant design. (10) back electromotive force if a large inductive load is connected at the output pin that might cause introducing back elec tromotive force at the start up and at the output disable, please insert protection diodes. (11) regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elem ents in order to keep them isolated. pn junctions are formed at the intersecti on of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): ? ? when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode ? when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasiti c diodes can result in mutual interference among circuits, operational faults, or physical dam age. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. output pin figure 26. back electromotive force downloaded from: http:///
datasheet datasheet 18/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (12) ground wiring pattern when using both small-signal and large-current gnd traces , the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gnd voltage. (13) operating condition the electrical characteristics indicated in this datasheet are not guaranteed for the wh ole operational and temperature ranges, however these characteristics do not significantly fluctuate within the operat ional and temperature ranges. (14) thermal shutdown (tsd) circuit the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off completely in the event of thermal overload. it is not designed to pr otect the ic from damage or guarantee its operation. ics should not be used after this function has activated, or in applications where the operation of th is circuit is assumed. if the thermal shutdown is activated while the load current exists, the output may possibly be latched off at the release of the thermal shutdown. (15) heat sink (fin) the heat sink (fin) is connected to the substrate. please connect it to gnd. tsd on temp.[ ] (typ.) hysteresis temp[ ] (typ.) 175 15 figure 27. example of ic structure resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element downloaded from: http:///
datasheet datasheet 19/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 thermal derating curves ordering information b d 9 5 8 3 5 e f j - e 2 part numbe r package efj: htsop-j8 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram htsop-j8(top view) d95835 part number marking lot number 1pin mark htsop-j8 package on 70 ? 70 ? 1.6 mm glass epoxy pcb (1) 4-layer board (backside copper foil area 70 mm ? 70 mm) (2) 2-layer board (backside copper foil area 70 mm ? 70 mm) (3) 2-layer board (backside copper foil area 15 mm ? 15 mm) (4) 1-layer board (backside copper foil area 0 mm ? 0 mm) (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.85 0.05 1.27 0.08 0.08 0.42 +0.05 - 0.04 1.05 0.2 0.65 0.15 4 + 6 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.9 0.1 6.0 0.2 (2.4) 3.9 0.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet datasheet 20/20 BD95835EFJ tsz02201-0333aac00210-1-2 29.may.2013 rev.004 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 31.aug.2012 001 new release 14.feb.2013 002 2/19 page block diagram 7.ss 8.ss 4.gnd added 2/19 page pin description boot bst 3/19 page operating ratings vin min. 4.2v 4.5v same as 1/19 page 4/19 page electrical characteristics boot bst 15/19 page i/o equivalence circuit boot bst 08.apr.2013 003 8/20 page constant on time and operating frequency (revised the description and calculation formula) 29.may.2013 004 1/20 page output voltage range (revised the description) 3/20 page output voltage range (revised the description) downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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